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Spring Clips for Mobile Devices
Molex introduces its low-profile, high-durability spring clips with anti-snag and closed tip designs


Molex's high-durability spring clips offer smartphone makers maximum cost savings with superb interconnect performance over a wide working range. The reduced area on the dimple provides higher contact pressure between mated device and spring clip for enhanced contact reliability. The closed tip prevents accidental snagging of terminal during processing operations. Stopper features on both sides of the clip prevent excess deflection of the terminal when pushed from sideways. Gold plating on the mating contact improves both mechanical and electrical performance of the interconnect when mated.

Features and Benefits

  • Wide working range from 0.25 mm to 1.10 mm (both series combined)

    • Offers greater design flexibility with specific loading control

  • Anti-snag design (105386)

    • Prevents contact damage during assembly processing and yield loss

  • Narrow clip width of 1 mm (105386)

    • Supports small PCB applications

  • 1,500 durability cycles (105386)

    • Delivers sustained high performance

  • Kinked ribs (105384)

    • Prevent solder wicking

  • Device-to-PCB grounding contact

    • Reduces EMI noise and electrostatic discharge

  • RF-to-PCB contact

    • Provides greater cost savings when used with non-soldered wire-less devices (for example, antennas)

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